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https://doi.org/10.3938/NPSM.70.119
Effect of an Organic Additive, N-Dimethyldithiocarbamic acid Ester Sodium salt, on Properties of Bismuth Telluride thin Films Fabricated by Galvanic Displacement Reaction of Electroplated Cobalt thin Films
New Phys.: Sae Mulli 2020; 70: 119~124
Published online February 28, 2020;  https://doi.org/10.3938/NPSM.70.119
© 2020 New Physics: Sae Mulli.

Jihyun KIM, Jeongsub LEE, Kimin HONG*

Department of Physics, Chungnam National University, Daejeon 34134, Korea
Correspondence to: kmhong@cnu.ac.kr
Received November 14, 2019; Revised January 21, 2020; Accepted January 21, 2020.
cc This is an open-access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/3.0/) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.
Abstract
We electroplated cobalt thin films and separated them from the electrodes. The cobalt thin films were converted to bismuth- telluride films by using a galvanic displacement reaction. The bismuth-telluride films obtained from the cobalt exhibited significant differences in morphology and electrical resistivity. The bismuth-telluride films fabricated from cobalt plated with a pure electrolyte had a polycrystalline amorphous structure and low resistivity. However, the bismuth-telluride films fabricated from cobalt plated with an additive showed significantly large resistivities. The increase in the resistivity can be attributed to the changes in the crystalline structure, which is caused by the additive during the electroplating process.
PACS numbers: 72.15.-v, 73.61.-r, 81.10.Dn, 82.45.Gj
Keywords: Cobalt thin film, Bismuth-telluride film, Electroplating, Electrical resistivity, Grain size


March 2020, 70 (3)
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