npsm 새물리 New Physics : Sae Mulli

pISSN 0374-4914 eISSN 2289-0041
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Article

Research Paper

New Physics: Sae Mulli 2016; 66: 511-516

Published online May 31, 2016 https://doi.org/10.3938/NPSM.66.511

Copyright © New Physics: Sae Mulli.

Development of a LED's Heat Sink by Using a Biodegradable Composite Plastic and Its Characterization

생분해성 복합 플라스틱을 이용한 LED 히트싱크 개발 및 특성분석

Sam Joo YOO, Joo Hyun LEE, Hyun Kyoung YANG*

Department of LED Convergence Engineering, Pukyong National University, Busan 48547, Korea

Correspondence to:hkyang@pknu.ac.kr

Received: December 28, 2015; Revised: February 11, 2016; Accepted: February 11, 2016

This is an open-access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/3.0/) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

A biodegradable plastic compound was prepared for use as a heat sink for light-emitting diodes (LEDs). Nano silver was permeated into the pores of activated carbon to produce polylactic acid (PLA) compounds. The PLA was mixed with a conductive filler for form an insulating crystallization nucleating agent for a biodegradable plastic compound. The samples for the heat sinks of LED were fabricated by using an injection compression molding process. The LED's heat sink was attached to the LED module. The thermal property of the LED's heat sink was measured by driving the LED lamps. The emissivity and the heat dissipation properties of the LED's heat sink were better than those of a general aluminum heat sink. The results suggest that the LED heat sink developed in this study can be used for applications in a variety of products.

Keywords: PLA, Biodegradation, LED heatsink

방사율이 우수하고 절연기능을 구비한 활성탄에 나노은을 침투하여 Poly-latic Acid (PLA)와 혼합한 생분해성 복합플라스틱 히트싱크를 제조하였다. 한국산업표준규격 퇴비화 조건을 통해 플라스틱의 호기성 생분해도 및 붕괴도 측정을 한 결과 플라스틱 분해 유효성 기준에 만족하는 것을 알 수 있었다. TG-DTA를 통해 246.33 $^\circ$C가 PLA를 이용하여 제품 제작할 경우 작업온도의 상한선임을 확인하였으며, 100 $^\circ$C에서 PLA의 질량변화가 없으므로 동작온도가 100 $^\circ$C이하인 발광다이오드 (light emitting diode, LED) 모듈에 문제없이 적용될 수 있다. 실제 등기구 제작결과 PLA가 적용된 히트싱크를 사용한 LED 모듈의 경우 방사율 및 방열성능이 일반 알루미늄에 비해 우수함을 확인할 수 있었다. 이 결과 PLA로 제작된 히트싱크는 다양한 제품에 응용이 가능할 것이다.

Keywords: PLA, 생분해, LED 히트싱크

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